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TDD-LTE Test Cards Test SIM Cards
General Factory 3G Nano NFC-Y V3.0 Test Cards
NFC+CMW500 test card which apply to 4G LTE networks and for NFC,CMW500, CMU200 and so on. working well in Foxconn, TCL, Sansung Factories.
Card Name
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CMU200 CMW500 Test SIM Card
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Support Network
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2G-GSM 3G-WCDMA 4G-LTE,
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Support Test Machine
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CMU200, CMW500,
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Test Items
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Wireless & IoT Testing
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Testing Workplace
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Mobile Phone Factory, Labs
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Specifaction:
1. GlobalPlatform Card Specification v2.2: Card Specification from GlabalPlatform.
2. ETSI TS 102 225(Relaese6): “Smart Cards; Secured packet structure for UICC based applications, European Telecommunications standards Institute Project Smart Card Platform (EP SCP), 2004”.
3. ETSI TS 102 226(Relaese6): “Smart cards; Remote APDU structure for UICC based applications, European Telecommunications standards Institute Project Smart Card Platform (EP SCP), 2004”.
4. ISO/IEC 14443-3: “Identification cards – Contactless integrated circuit(s) cards – Proximity cards – Part 3: Initialization and
anti-conllision”.
5. ISO/IEC 14443-4: “Identification cards – Contactless integrated circuit(s) cards – Proximity cards – Part 4: Transmission protocol”.
6. ETSI TS 102 622: “Smat Cards; UICC – Contactless Front-end (CLF) Interface; Host Controller Interface (HCI)(Release 7)”.
7. ISO/IEC 7816-6: “Identification cards – Interindustry data elements for interchange”.
8. ISO/IEC 8825-1: “Information technology – ASN.1 encoding rules: Specification of Basic Encoding Rules (BER), Canonical Encoding Rules (CER) and Distinguished Encoding Rules (DER)”.
9. ISO/IEC 8859-1: “Information technology – 8-bit single-byte coded graphic character sets – Part 1: Latin alphabet No.1”.
10. IETF RFC 3629: “UTF-8, a transformation format of ISO 10646”.
11. ISO/IEC 18092: “Information technology – Telecommunications and information exchange between systems – Near Field Communication– Interface and Protocol (NFCIP-1)”.
12. ETSI TS 102 223: “Smart cards; Card Application Toolkit (CAT)(Release 6)”.
13. Java CardTM 3.0 Runtime Environment, Classic Edition: “Runtime Environment Specification – Java CardTM 3.0, Classic Edition”.
14. ISO/IEC 10918-1: “Information technology – Digital compression and coding of continuous-tone still images: Requirements and guidelines”.
15. ETSI TS 102 221: “Smart cards; UICC-Terminal Interface; Physical and Logical Characteristics”.
16. ETSI TS 102 223: “Smart cards; Card Application Toolkit (CAT)(Release 6)”.
17. ETSI TS 102 224: “Smart Cards; Security mechanisms for UICC based Applications – Functional requirements”.
18. ETSI TS 123 048: “Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS);Security mechanisms for the (U)SIM/USIM application toolkit; Stage 2 (3GPP TS 23.048 Release 5)”.
19. ETSI TS 102 127: “Smart Cards; Transport protocol for CAT applications; Stage 2”.
20. Java CardTM Specification Version: 2.2.1
21. Sun Microsystems Java Card? Specification: “Java Card? 2.2.1 Application Programming Interface”.
22. Sun Microsystems Java Card? Specification: “Java Card? 2.2.1 Virtual Machine Specification”.
23. ETSI TS 102 241: “Smart Cards; UICC Application Programming Interface (UICC API) for Java Card (TM); (Release 6)”.
24. 3GPP TS 31 130 Release 6: “(U)SIM API for Java Card?”
25. ETSI TS 102 268: “Test specification for UICC Application Programming Interface for Java Card (TM); (Release 6)”.
26. ETSI TS 131 213 (3GPP TS 31.213 version 6.1.0 Release 6): “Test specification for subscriber (U)SIM; Application Programming Interface (API) for Java Card?”.
27. ETSI TS 143 019 : Technical Specification Digital cellular telecommunications system (Phase 2+);Subscriber Identity Module Application Programming Interface (SIM API) for Java Card; Stage2(3GPP TS 43.019 version 6.0.0 Release 6)
28. ETSI TS 151 013 : Test specification for SIM API for Java Card
Basic Features:
Multi-Networking:
GSM, WCDMA & LTE
Multi-Algorithm:
Comp128 1/2/3, AntiClone,
Milenage, Cave
RFM/RAM
Java 3.0 Classic
Global Platform 2.2.1
Garbage collection
Multi channel
Multi security domain
BIP/CAT-TP
GP Features :
Support ISD, SSD, SSD customization
Support CRS, CREL
Support CVM
Support Authorization Manament, DAP, TOKEN
Support GP API
Support SCP02 & SCP10
Support GPAC (Interaction framework with Android)
API :UICC/SIM/USIM API,JavaCard API,GP API,HCI API
Crypto :
DES 3DES RSA
SHA1 MD5 AES
SM1/2/3/4 (optional)
XOR MILENAGE GSM SNOW3G
NFC Function :Optional (S50, S70)
DATASHEET(PART):
OS: GSM/WCDMA/LTE
ICCID: 89525301234XXXXXXXXX
IMSI: 001010XXXXXXXXX
PIN1:XXXX
PUK1:XXXXXXXX
PUK2:XXXXXXXX
HKCARD ELECTRONICS CO.,LIMITED
Whatsapp/wechat:+8615817372512
Skype:byron1681
Email:byron@cardmfg.com
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